Other Instrumentation
The following items are part of the Keck Lab but located in JILA X110.

Dicing Saw
Dicing Saw
Used for dicing or scribing glass, sapphire, and semiconductor substrates using a high-speed diamond blade.

Make: Micro Automation
Model: M1006
Maximum Substrate Diameter: 6 inches
Maximum Substrate Thickness: 5mm
Camera Magnification: 100X

Crystal Saw
Used to dice optical crystals and small substrates using a low-speed diamond blade.

Make: South Bay Technologies, Inc.
Model: 650
Features: Variable angle holder, micrometer advancement

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