Instrumentation
Other Instrumentation
The following items are part of the Keck Lab but located in JILA X110.

Crystal Saw
Used to dice optical crystals and small substrates using a low-speed diamond blade.

Make: South Bay Technologies, Inc.
Model: 650
Features: Variable angle holder, micrometer advancement

Dicing Saw
Dicing Saws
Used for dicing or scribing glass, sapphire, and semiconductor substrates using a high-speed diamond blade.

Make: Micro Automation
Model: M1006
Maximum Substrate Diameter: 6 inches
Maximum Substrate Thickness: 5mm
Spindle Torque: .350 kW
Camera Magnification: 100X

Make: Micro Automation
Model: M1100
Maximum Substrate Diameter: 6 inches
Maximum Substrate Thickness: 5mm
Spindle Torque: .900 kW
Camera Magnification: 80X

Tube Furnace
Used for annealing, oxidize growth, and chemical vapor deposition.

Make: Lindberg/Blue M
Model: 55035-A
Max. Temperature: 1000°C, single zone
Tube ID: 25mm


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